Ceramic component manufacturing is a sequential process with no shortcuts. Raw powder → forming → sintering → grinding → finishing. Each stage has multiple route options optimized for different geometries and materials. Below is the full process map — what runs in our Hangzhou facility and how the choices shape your finished part's properties and cost.
Different product geometries and material grades dictate different process route choices. The matrix below shows the typical forming + sintering route for our 6 major product families. Custom routes available — DFM review identifies the right combination for your part.
| Product Family | Unit | Forming Route | Sintering Route | Finishing |
|---|---|---|---|---|
| Hot Surface Igniters | BLK | Injection molding | Pressureless | Grind + electrical test |
| Precision Balls (G3–G10) | balls | Dry press | HIP | Lap + Talyrond |
| Grinding Media (G40+) | balls | Dry press | Pressureless | Tumble + screen |
| Structural Parts | custom | CIP or slip | Pressureless | Diamond grind + CMM |
| Armor Tiles (B₄C) | tiles | Dry press | Hot press | Grind + ballistic test |
| Semiconductor (CVD-SiC) | rings | CVD deposition | (deposited) | Lap + particle scan |
In-house synthesized Si₃N₄ and ZrO₂ powders, or external high-purity Al₂O₃/SiC/AlN/BN/B₄C powders received via incoming inspection. Powder classified to target PSD, mixed with sintering aids and binder system. Output: ready-to-form powder slurry or granule.
CIP: isotropic pressing for tubes, rods, large parts. Slip casting: complex hollow shapes. Injection molding: complex small parts with high volume. Dry press: simple geometries at high throughput. Route choice depends on geometry, volume, and material.
Pressureless sintering: default, lowest cost. Hot pressing (HP): higher density, used for armor tiles and dense seal faces. Hot isostatic pressing (HIP): highest density (99.5%+ theoretical), used for precision bearing balls and aerospace structural parts. Each method delivers a different density and strength outcome.
Sintered ceramic is too hard for conventional metal-cutting tooling — finishing is exclusively diamond-tool grinding. Cylindrical, surface, and CNC profile grinding available. Standard tolerance ±0.005 mm; tighter tolerances (±0.002 mm) via additional lapping at extra cost.
Optional lapping for surface finish to Ra ≤0.02 μm (precision balls, bearing races, semiconductor components). Polishing for optical-grade surfaces. Final inspection: CMM, Talyrond, profilometer, SEM as required by product family. Lot cert generated, packaging.
Send STEP/PDF/DWG drawing + duty profile. Our DFM team recommends the right process route within 48 hours — forming method, sintering method, finishing steps, and resulting tolerance/finish/cost outcome.
A US OEM was quoting their custom Si₃N₄ structural part via CIP forming (the route that worked in their bench tests). At their target 50K units/year volume, we recommended switching to injection molding instead — the tooling investment paid back in 18 months while delivering the same finished tolerance after grinding. Their unit cost dropped 30% on the full-rate production run. Process choice isn't always obvious from the drawing alone.